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Application module:
Via component |
ISO/TS 10303-1754:2010-03(E)
© ISO
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Index
Blind_via
ARM object definition
4.2.1
mapping specification
5.1.1
blind_via
Buried_via
ARM object definition
4.2.2
mapping specification
5.1.2
buried_via
Interconnect_module_connection_routing_arm
Interconnect_module_connection_routing_mim
Interfacial_connection
ARM object definition
4.2.3
mapping specification
5.1.3
interfacial_connection
Layered_interconnect_module_design_arm
Layered_interconnect_module_design_mim
Non_conductive_base_blind_via
ARM object definition
4.2.4
mapping specification
5.1.4
non_conductive_base_blind_via
Plated_conductive_base_blind_via
ARM object definition
4.2.5
mapping specification
5.1.5
plated_conductive_base_blind_via
via_subtypes
ARM object definition
4.3.1
via_subtypes
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