Application module: Via component ISO/TS 10303-1754:2010-03(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM entity definitions
   4.3 ARM subtype constraint definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM entity definitions
     5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
Bibliography
Index

Index

Blind_via
   ARM object definition 4.2.1
   ARM EXPRESS-G C.2
   mapping specification 5.1.1
blind_via
   MIM object definition 5.2.1.1
   MIM EXPRESS-G D.2
Buried_via
   ARM object definition 4.2.2
   ARM EXPRESS-G C.2
   mapping specification 5.1.2
buried_via
   MIM object definition 5.2.1.2
   MIM EXPRESS-G D.2
Interconnect_module_connection_routing_arm
   ARM interface 4.1
Interconnect_module_connection_routing_mim
   MIM interface 5.2
Interfacial_connection
   ARM object definition 4.2.3
   ARM EXPRESS-G C.2
   mapping specification 5.1.3
interfacial_connection
   MIM object definition 5.2.1.3
   MIM EXPRESS-G D.2
Layered_interconnect_module_design_arm
   ARM interface 4.1
Layered_interconnect_module_design_mim
   MIM interface 5.2
Non_conductive_base_blind_via
   ARM object definition 4.2.4
   ARM EXPRESS-G C.2
   mapping specification 5.1.4
non_conductive_base_blind_via
   MIM object definition 5.2.1.4
   MIM EXPRESS-G D.2
Plated_conductive_base_blind_via
   ARM object definition 4.2.5
   ARM EXPRESS-G C.2
   mapping specification 5.1.5
plated_conductive_base_blind_via
   MIM object definition 5.2.1.5
   MIM EXPRESS-G D.2
via_subtypes
   ARM object definition 4.3.1
   ARM EXPRESS-G C.2
via_subtypes
   MIM object definition 5.2.2.1
   MIM EXPRESS-G D.2


© ISO 2009 — All rights reserved