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Application module:
Via component |
ISO/TS 10303-1754:2010-03(E)
© ISO
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TECHNICAL SPECIFICATION |
ISO/TS 10303-1754:2009(E) |
Industrial automation systems and integration —
Product data representation and exchange —
Part 1754:
Application module:
Via component
This part of ISO 10303 specifies the application module
Via component.
The following are within the scope of this part of ISO 10303:
- blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
- cylinder vias, where the cross-section shape is constant;
- tapered vias, where the cross-section shape may vary as the vertical distance changes;
- stacked vias, where multiple bind and buried vias share the same x y position;
- filled vias, where material may be inserted into the via during realization processes, which are
within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
- buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
- interfacial connections, also known as through hole vias, which have both ends exposed;
- items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
The following are outside the scope of this part of ISO 10303:
- Stratum features;
- Cutouts.
© ISO 2009 — All rights reserved