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Application module:
Via component |
ISO/TS 10303-1754:2010-03(E)
© ISO
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This clause specifies the EXPRESS schema derived from the mapping
table.
It uses elements from the common resources or from other application
modules and defines the EXPRESS constructs that are specific to this
part of ISO 10303.
This clause constitutes the Module Interpreted Module (MIM) of the
application module.
This clause also
specifies the modifications that apply to the constructs
imported from the common resources.
The following restrictions apply to the use, in this schema, of constructs defined in common resources or in application
modules:
-
use of a supertype entity does not make applicable any of its
specializations, unless the specialization is also imported in the
MIM schema;
-
use of a SELECT type does not make applicable any of its listed types
unless the listed type is also imported in the MIM schema.
EXPRESS specification:
*)
SCHEMA Via_component_mim;
USE FROM
Interconnect_module_connection_routing_mim;
--
ISO/TS 10303-1684
USE FROM
Layered_interconnect_module_design_mim;
--
ISO/TS 10303-1698
(*
NOTE 1
The schemas referenced above are specified in the following
part of ISO 10303:
| Interconnect_module_connection_routing_mim |
ISO/TS 10303-1684 |
| Layered_interconnect_module_design_mim |
ISO/TS 10303-1698 |
NOTE 2
See Annex D,
Figures
D.1and D.2
for a graphical representation of this schema.
This subclause specifies the MIM entities for this
module. The MIM entities and definitions are specified below.
A blind_via is a type of
via
that implements the ARM concepts of
Blind_via.
A blind_via is one of a
non_conductive_base_blind_via
or a
plated_conductive_base_blind_via.
EXPRESS specification:
*)
ENTITY blind_via
ABSTRACT SUPERTYPE
OF (ONEOF (non_conductive_base_blind_via,
plated_conductive_base_blind_via))
SUBTYPE OF (via);
END_ENTITY;
(*
A buried_via is a type of
via
that implements the ARM concepts of
Buried_via.
EXPRESS specification:
*)
ENTITY buried_via
SUBTYPE OF (via);
END_ENTITY;
(*
A interfacial_connection is a type of
via
that implements the ARM concepts of
Interfacial_connection.
EXPRESS specification:
*)
ENTITY interfacial_connection
SUBTYPE OF (via);
END_ENTITY;
(*
A non_conductive_base_blind_via is a type of
blind_via
that implements the ARM concepts of
Non_conductive_base_blind_via.
EXPRESS specification:
*)
ENTITY non_conductive_base_blind_via
SUBTYPE OF (blind_via);
END_ENTITY;
(*
A plated_conductive_base_blind_via is a type of
blind_via
that implements the ARM concepts of
Plated_conductive_base_blind_via.
EXPRESS specification:
*)
ENTITY plated_conductive_base_blind_via
SUBTYPE OF (blind_via);
END_ENTITY;
(*
This subclause specifies the MIM subtype constraint for
this module. The subtype constraint places a constraint on the
possible super-type / subtype instantiations.
The MIM subtype constraint and definition is
specified below.
A via_subtypes specifies a constraint that applies to instances of subtypes of
via.
EXPRESS specification:
*)
SUBTYPE_CONSTRAINT via_subtypes FOR via;
ONEOF (blind_via,
buried_via,
interfacial_connection);
END_SUBTYPE_CONSTRAINT;
(*
*)
END_SCHEMA; -- Via_component_mim
(*
© ISO 2009 — All rights reserved
