Application module: Via component ISO/TS 10303-1754:2010-03(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM entity definitions
   4.3 ARM subtype constraint definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM entity definitions
     5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
Bibliography
Index

4 Information requirements

This clause specifies the information requirements for the Via component application module. The information requirements are specified as the Application Reference Model (ARM) of this application module.

NOTE 1  A graphical representation of the information requirements is given in Annex C.

NOTE 2  The mapping specification is specified in 5.1. It shows how the information requirements are met by using common resources and constructs defined or imported in the MIM schema of this application module.

The following EXPRESS specification begins the Via_component_arm schema and identifies the necessary external references.

EXPRESS specification:

*)
SCHEMA Via_component_arm;
(*

4.1 Required AM ARMs

The following EXPRESS interface statements specify the elements imported from the ARMs of other application modules.

EXPRESS specification:

*)
USE FROM Interconnect_module_connection_routing_arm;    --  ISO/TS 10303-1684

USE FROM Layered_interconnect_module_design_arm;    --  ISO/TS 10303-1698
(*

NOTE 1   The schemas referenced above are specified in the following part of ISO 10303:

Interconnect_module_connection_routing_arm ISO/TS 10303-1684
Layered_interconnect_module_design_arm ISO/TS 10303-1698

NOTE 2   See Annex C, Figures C.1and C.2 for a graphical representation of this schema.

4.2 ARM entity definitions

This subclause specifies the ARM entities for this module. Each ARM application entity is an atomic element that embodies a unique application concept and contains attributes specifying the data elements of the entity. The ARM entities and definitions are specified below.

4.2.1 Blind_via   EXPRESS-GMapping table

A Blind_via is a type of Via. Each Blind_via is either a Non_conductive_base_blind_via, or a Plated_conductive_base_blind_via. Blind_via is defined in IEC 60050-541.

EXAMPLE    Figure 1 illustrates an idealized cross-section of an interconnect substrate, showing the depth of penetration of a Blind_via into the substrate. The Blind_vias in this example are filled with resin extruded from the dielectric Stratum represented with a cross-hatch pattern.



Figure 1 —  Blind via

Figure 1 —  Blind via

EXPRESS specification:

*)
ENTITY Blind_via
  ABSTRACT SUPERTYPE OF (ONEOF (Non_conductive_base_blind_via,
                                Plated_conductive_base_blind_via))
  SUBTYPE OF (Via);
END_ENTITY;
(*

4.2.2 Buried_via   EXPRESS-GMapping table

A Buried_via is a type of Via. Buried_via is defined in IEC 60050-541.

EXAMPLE    Figure 2 illustrates a Buried_via in a cross-section view of an interconnect substrate. The Buried_via in this example is filled by standard material processing; in this case excess resin from the dielectric Stratum represented with a cross-hatch pattern.



Figure 2 —  Buried via

Figure 2 —  Buried via

EXPRESS specification:

*)
ENTITY Buried_via
  SUBTYPE OF (Via);
END_ENTITY;
(*

4.2.3 Interfacial_connection   EXPRESS-GMapping table

An Interfacial_connection is a type of Via that has both ends visible in the printed circuit board. Interfacial_connection is defined in IEC 60050-541.

EXAMPLE    Figure 3 illustrates an Interfacial_connection in a cross-section view of a substrate. The Interfacial_connection in this example is not filled.



Figure 3 —  Interfacial connection

Figure 3 —  Interfacial connection

EXPRESS specification:

*)
ENTITY Interfacial_connection
  SUBTYPE OF (Via);
END_ENTITY;
(*

4.2.4 Non_conductive_base_blind_via   EXPRESS-GMapping table

A Non_conductive_base_blind_via is a type of Blind_via with a floor whose material is non-conductive.

EXPRESS specification:

*)
ENTITY Non_conductive_base_blind_via
  SUBTYPE OF (Blind_via);
END_ENTITY;
(*

4.2.5 Plated_conductive_base_blind_via   EXPRESS-GMapping table

A Plated_conductive_base_blind_via is a type of Blind_via in which the material that composes the floor of the Blind_via is conductive, and in which the floor material of the Blind_via is contiguous with the material on the wall of the Blind_via. The process that is to create this conductive contiguous material is electroplating or similar.

EXPRESS specification:

*)
ENTITY Plated_conductive_base_blind_via
  SUBTYPE OF (Blind_via);
END_ENTITY;
(*

4.3 ARM subtype constraint definition

This subclause specifies the ARM subtype constraint for this module. The subtype constraint places a constraint on the possible super-type / subtype instantiations. The ARM subtype constraint and definition is specified below.

4.3.1 via_subtypes   EXPRESS-GMapping table

The via_subtypes constraint specifies a constraint that applies to instances of subtypes of Via.

EXPRESS specification:

*)
SUBTYPE_CONSTRAINT via_subtypes FOR Via;
  ONEOF (Blind_via,
         Buried_via,
         Interfacial_connection);
END_SUBTYPE_CONSTRAINT;
(*



*)
END_SCHEMA;  -- Via_component_arm
(*

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