Application module: Via component ISO/TS 10303-1754:2010-03(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM entity definitions
   4.3 ARM subtype constraint definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM entity definitions
     5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
Bibliography
Index

Mapping tableIndex of EXPRESS-G pagesFirst pagePrevious page
Figure C.2 — ARM entity level EXPRESS-G diagram 1 of 1 ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.via ../via_component/sys/4_info_reqs.htm#via_component_arm.non_conductive_base_blind_via ../via_component/sys/4_info_reqs.htm#via_component_arm.blind_via ../via_component/sys/4_info_reqs.htm#via_component_arm.interfacial_connection ../via_component/sys/4_info_reqs.htm#via_component_arm.plated_conductive_base_blind_via ../via_component/sys/4_info_reqs.htm#via_component_arm.buried_via ../via_component/sys/4_info_reqs.htm#via_component_arm.via_subtypes


Figure C.2 — ARM entity level EXPRESS-G diagram 1 of 1


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