Application module: Via component | ISO/TS 10303-1754:2010-03(E) © ISO |
(*
ISO TC184/SC4/WG12 N6556 - ISO/TS 10303-1754 Via component - EXPRESS MIM
Supersedes
ISO TC184/SC4/WG12 N5822
*)
SCHEMA Via_component_mim;
USE FROM
Interconnect_module_connection_routing_mim;
-- ISO/TS 10303-1684
USE FROM
Layered_interconnect_module_design_mim;
-- ISO/TS 10303-1698
ENTITY blind_via
ABSTRACT SUPERTYPE
OF (ONEOF (non_conductive_base_blind_via,
plated_conductive_base_blind_via))
SUBTYPE OF (via);
END_ENTITY;
ENTITY buried_via
SUBTYPE OF (via);
END_ENTITY;
ENTITY interfacial_connection
SUBTYPE OF (via);
END_ENTITY;
ENTITY non_conductive_base_blind_via
SUBTYPE OF (blind_via);
END_ENTITY;
ENTITY plated_conductive_base_blind_via
SUBTYPE OF (blind_via);
END_ENTITY;
SUBTYPE_CONSTRAINT via_subtypes FOR via;
ONEOF (blind_via,
buried_via,
interfacial_connection);
END_SUBTYPE_CONSTRAINT;
END_SCHEMA; -- Via_component_mim
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