Application module: Via component ISO/TS 10303-1754:2010-03(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM entity definitions
   4.3 ARM subtype constraint definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM entity definitions
     5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
Bibliography
Index

(*
ISO TC184/SC4/WG12 N6556 - ISO/TS 10303-1754 Via component - EXPRESS MIM
Supersedes ISO TC184/SC4/WG12 N5822
*)



SCHEMA Via_component_mim;

USE FROM Interconnect_module_connection_routing_mim;    -- ISO/TS 10303-1684

USE FROM Layered_interconnect_module_design_mim;    -- ISO/TS 10303-1698


ENTITY blind_via
  ABSTRACT SUPERTYPE OF (ONEOF (non_conductive_base_blind_via,
                                plated_conductive_base_blind_via))
  SUBTYPE OF (via);
END_ENTITY;

ENTITY buried_via
  SUBTYPE OF (via);
END_ENTITY;

ENTITY interfacial_connection
  SUBTYPE OF (via);
END_ENTITY;

ENTITY non_conductive_base_blind_via
  SUBTYPE OF (blind_via);
END_ENTITY;

ENTITY plated_conductive_base_blind_via
  SUBTYPE OF (blind_via);
END_ENTITY;

SUBTYPE_CONSTRAINT via_subtypes FOR via;
  ONEOF (blind_via,
         buried_via,
         interfacial_connection);
END_SUBTYPE_CONSTRAINT;

END_SCHEMA;  -- Via_component_mim


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