Application module: Via component ISO/TS 10303-1754:2010-03(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM entity definitions
   4.3 ARM subtype constraint definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM entity definitions
     5.2.2 MIM subtype constraint definition

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
Bibliography
Index

(*
ISO TC184/SC4/WG12 N6555 - ISO/TS 10303-1754 Via component - EXPRESS ARM
Supersedes ISO TC184/SC4/WG12 N5821
*)



SCHEMA Via_component_arm;

USE FROM Interconnect_module_connection_routing_arm;    -- ISO/TS 10303-1684

USE FROM Layered_interconnect_module_design_arm;    -- ISO/TS 10303-1698


ENTITY Blind_via
  ABSTRACT SUPERTYPE OF (ONEOF (Non_conductive_base_blind_via,
                                Plated_conductive_base_blind_via))
  SUBTYPE OF (Via);
END_ENTITY;

ENTITY Buried_via
  SUBTYPE OF (Via);
END_ENTITY;

ENTITY Interfacial_connection
  SUBTYPE OF (Via);
END_ENTITY;

ENTITY Non_conductive_base_blind_via
  SUBTYPE OF (Blind_via);
END_ENTITY;

ENTITY Plated_conductive_base_blind_via
  SUBTYPE OF (Blind_via);
END_ENTITY;

SUBTYPE_CONSTRAINT via_subtypes FOR Via;
  ONEOF (Blind_via,
         Buried_via,
         Interfacial_connection);
END_SUBTYPE_CONSTRAINT;

END_SCHEMA;  -- Via_component_arm


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