Application module: Via component | ISO/TS 10303-1754:2010-03(E) © ISO |
(*
ISO TC184/SC4/WG12 N6555 - ISO/TS 10303-1754 Via component - EXPRESS ARM
Supersedes
ISO TC184/SC4/WG12 N5821
*)
SCHEMA Via_component_arm;
USE FROM
Interconnect_module_connection_routing_arm;
-- ISO/TS 10303-1684
USE FROM
Layered_interconnect_module_design_arm;
-- ISO/TS 10303-1698
ENTITY Blind_via
ABSTRACT SUPERTYPE
OF (ONEOF (Non_conductive_base_blind_via,
Plated_conductive_base_blind_via))
SUBTYPE OF (Via);
END_ENTITY;
ENTITY Buried_via
SUBTYPE OF (Via);
END_ENTITY;
ENTITY Interfacial_connection
SUBTYPE OF (Via);
END_ENTITY;
ENTITY Non_conductive_base_blind_via
SUBTYPE OF (Blind_via);
END_ENTITY;
ENTITY Plated_conductive_base_blind_via
SUBTYPE OF (Blind_via);
END_ENTITY;
SUBTYPE_CONSTRAINT via_subtypes FOR Via;
ONEOF (Blind_via,
Buried_via,
Interfacial_connection);
END_SUBTYPE_CONSTRAINT;
END_SCHEMA; -- Via_component_arm
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