|
Application module:
Fabrication technology |
ISO/TS 10303-1670:2018-11(E)
© ISO
|
3.1.1 Terms defined in ISO 10303-1
For the purposes of this document,
the following terms defined in
ISO 10303-1
apply:
3.1.2 Terms defined in IEC 60050-541
For the purposes of this document,
the following terms defined in
IEC 60050-541
apply:
3.1.3 Other terms and definitions
For the purposes of this document,
the following terms and definitions apply:
intermediate stage in the reaction of a thermosetting resin in which the material melts when heated and dissolves in certain
solvents
final stage of the curing of a thermosetting resin in which the material has become infusible and insoluble in common solvents
protective, dielectric coating designed to conform to the surface of a PWA or PCA
rigid plate with a pattern of voids to create glue patterns during a manufacturing process
product made by bonding together two or more layers of material or materials
rigid plate with a pattern of voids used to create solder paste patterns during a manufacturing process. Solder paste is
deposited only where there are voids in the plate
combination of mat, fabric, nonwoven material, or roving with resin, usually advanced to the B-stage, ready for curing
B-stage
material flow properties intermediate between liquids and solids
material layer realized by transferring an image to a surface by forcing suitable media through a stencil screen with a squeegee
insulating layer of a PCB or PWB that exposes only the areas to be soldered
specially blended paste consisting of carefully graded solder powder particles, and a flux medium designed to give the paste
particular printing and reflow characteristics
layer of material in the sequence of materials that compose a PCB, and that usually has an aspect ratio that is very large,
typically 1,000:1
For the purposes of this document, the following abbreviated terms
apply:
AM |
application module |
AP |
application protocol |
ARM |
application reference model |
MIM |
module interpreted model |
PCA |
Printed Circuit Assembly |
PCB |
Printed Circuit Board |
prepreg
|
preimpregnated |
PWA |
Printed Wiring Assembly |
PWB |
Printed Wiring Board |
URL |
uniform resource locator |
© ISO 2018 — All rights reserved