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Application module:
Sequential laminate assembly design |
ISO/TS 10303-1741:2018-11(E)
© ISO
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TECHNICAL SPECIFICATION |
ISO/TS 10303-1741:2018-11(E) |
Industrial automation systems and integration —
Product data representation and exchange —
Part 1741:
Application module:
Sequential laminate assembly design
This part of ISO 10303 specifies the application module
Sequential laminate assembly design.
The following are within the scope of this part of ISO 10303:
- sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
The following are outside the scope of this part of ISO 10303:
- detailed process description of how to create a via;
- detailed process description of how to create the bond between multiple laminate components;
- detailed process description of how to embed components in a substrate.
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