Application module: Layered interconnect module with printed component design ISO/TS 10303-1700:2018-11(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM type definitions
   4.3 ARM entity definitions
   4.4 ARM subtype constraint definitions
   4.5 ARM function definitions
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM type definition
     5.2.2 MIM entity definitions
     5.2.3 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

Mapping tableIndex of EXPRESS-G pagesFirst pagePrevious page
Figure C.3 — ARM entity level EXPRESS-G diagram 2 of 2 ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.conductor_or_conductive_filled_area ./armexpg2.htm ./armexpg2.htm ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.conductor ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum_feature_template_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.conductive_filled_area ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.printed_part_template_join_terminal ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.laminate_component_interface_terminal ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.laminate_component_join_terminal ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.printed_part_template_interface_terminal ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.printed_component_join_terminal ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.printed_connector_component_interface_terminal


Figure C.3 — ARM entity level EXPRESS-G diagram 2 of 2


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