Application module: Layered interconnect module with printed component design | ISO/TS 10303-1700:2018-11(E) © ISO |
TECHNICAL SPECIFICATION | ISO/TS 10303-1700:2018-11(E) |
This part of ISO 10303 specifies the application module Layered interconnect module with printed component design. The following are within the scope of this part of ISO 10303:
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