Application module: Layered interconnect module with printed component design ISO/TS 10303-1700:2018-11(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM type definitions
   4.3 ARM entity definitions
   4.4 ARM subtype constraint definitions
   4.5 ARM function definitions
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM type definition
     5.2.2 MIM entity definitions
     5.2.3 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

Mapping tableIndex of EXPRESS-G pagesFirst pagePrevious pageNext pageLast page
Figure C.2 — ARM entity level EXPRESS-G diagram 1 of 2 ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.limwpcd_external_identification_item ./armexpg3.htm ./armexpg3.htm ../product_occurrence/sys/4_info_reqs.htm#product_occurrence_arm.single_instance ../external_item_identification_assignment/sys/4_info_reqs.htm#external_item_identification_assignment_arm.external_source_identification ../constructive_solid_geometry_2d/sys/4_info_reqs.htm#constructive_solid_geometry_2d_arm.curve_style_parameters ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.multi_stratum_printed_part_template ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.laminate_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum_feature ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum_feature_based_derived_pattern ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.structured_layout_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.structured_layout_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.plated_passage ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.printed_part_cross_section_template ../external_item_identification_assignment/sys/4_info_reqs.htm#external_item_identification_assignment_arm.external_identification_item ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.printed_tiebar_template ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.inter_stratum_extent ../basic_geometry/sys/4_info_reqs.htm#basic_geometry_arm.curve ../land/sys/4_info_reqs.htm#land_arm.plated_passage_dependent_land ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.structured_layout_component_sub_assembly_relationship ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.basic_multi_stratum_printed_part_template ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.printed_part_template ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.printed_connector_template ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.area_component ../printed_physical_layout_template/sys/4_info_reqs.htm#printed_physical_layout_template_arm.single_stratum_printed_part_template ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.generic_physical_network ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum_feature ../assembly_component/sys/4_info_reqs.htm#assembly_component_arm.assembly_component ../layered_interconnect_module_design/sys/4_info_reqs.htm#layered_interconnect_module_design_arm.stratum ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.tiebar_printed_component ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.single_stratum_printed_component ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.multi_stratum_printed_component ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.basic_multi_stratum_printed_component ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.printed_connector_component ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.routed_transmission_line ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.printed_component ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.limwpcd_structured_layout_component_subtypes ../layered_interconnect_module_with_printed_component_design/sys/4_info_reqs.htm#layered_interconnect_module_with_printed_component_design_arm.limwpcd_assembly_component_subtypes


Figure C.2 — ARM entity level EXPRESS-G diagram 1 of 2


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