ISO/TS 10303-1643:2018-11 Assembly module with interconnect component


Application module: Assembly module with interconnect component	ISO/TS 10303-1643:2018-11(E) © ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
3.2 Abbreviated terms

4 Information requirements
4.1 Required AM ARMs
4.2 ARM type definition
4.3 ARM entity definitions
4.4 ARM subtype constraint definitions
5 Module interpreted model
5.1 Mapping specification
5.2 MIM EXPRESS short listing
5.2.1 MIM entity definitions
5.2.2 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G
D MIM EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
3.2 Abbreviated terms
4 Information requirements
4.1 Required AM ARMs
4.2 ARM type definition
          4.2.1 conductive_interconnect_terminal_or_interconnect_component_join_terminal
4.3 ARM entity definitions
          4.3.1 Assembly_connection_zone_position_relationship
          4.3.2 Bare_die_component
          4.3.3 Bare_die_component_terminal
          4.3.4 Component_overlap_relationship
          4.3.5 Design_view_terminal_component_shape_relationship
          4.3.6 Interconnect_component_interface_terminal
          4.3.7 Interconnect_component_join_terminal
          4.3.8 Interconnect_module_component
          4.3.9 Interconnect_module_component_surface_feature
          4.3.10 Interconnect_module_component_terminal
          4.3.11 Layered_assembly_module_design_view
          4.3.12 Layered_assembly_module_terminal
          4.3.13 Layered_assembly_module_usage_view
          4.3.14 Layered_assembly_panel_design_view
          4.3.15 Movable_packaged_component_join_terminal
          4.3.16 Routed_interconnect_component
          4.3.17 Routed_physical_component
4.4 ARM subtype constraint definitions
          4.4.1 assembly_module_design_view_subtypes
          4.4.2 physical_component_subtypes
          4.4.3 amd_physical_component_terminal_subtypes
5 Module interpreted model
5.1 Mapping specification
          5.1.1 Assembly_connection_zone_position_relationship
          5.1.2 Bare_die_component
          5.1.3 Bare_die_component_terminal
          5.1.4 Component_overlap_relationship
          5.1.5 Design_view_terminal_component_shape_relationship
          5.1.6 Interconnect_component_interface_terminal
          5.1.7 Interconnect_component_join_terminal
          5.1.8 Interconnect_module_component
          5.1.9 Interconnect_module_component_surface_feature
          5.1.10 Interconnect_module_component_terminal
          5.1.11 Layered_assembly_module_design_view
          5.1.12 Layered_assembly_module_terminal
          5.1.13 Layered_assembly_module_usage_view
          5.1.14 Layered_assembly_panel_design_view
          5.1.15 Movable_packaged_component_join_terminal
          5.1.16 Routed_interconnect_component
          5.1.17 Routed_physical_component
          5.1.18 physical_component_subtypes
          5.1.19 amd_physical_component_terminal_subtypes
5.2 MIM EXPRESS short listing
5.2.1 MIM entity definitions
          5.2.1.1 bare_die_component
          5.2.1.2 interconnect_module_component
          5.2.1.3 interconnect_module_component_surface_feature
          5.2.1.4 layered_assembly_module_design_view
          5.2.1.5 layered_assembly_module_usage_view
          5.2.1.6 layered_assembly_panel_design_view
          5.2.1.7 routed_interconnect_component
          5.2.1.8 routed_physical_component
5.2.2 MIM subtype constraint definitions
          5.2.2.1 amwic_assembly_module_design_view_subtypes
          5.2.2.2 amwic_physical_component_subtypes
Annex A MIM short names
Annex B Information object registration
   B.1 Document identification
   B.2 Schema identification
Annex C ARM EXPRESS-G
Annex D MIM EXPRESS-G
Annex E Computer interpretable listings
Annex F Change history
F.1 General
F 2 Changes made in edition 2
F 2.1 Summary of changes
F 2.2 Changes made to the ARM
F 3 Changes made in edition 3
F 3.1 Summary of changes
F 3.2 Changes made to the ARM
F 4 Changes made in edition 4
F 4.1 Summary of changes
F 4.2 Changes made to the ARM
F 4.3 Changes made to the MIM
Bibliography
Index

Figures

Figure 1 — Assembly component
Figure 2 — Part design view with an interconnect module component
Figure 3 — Interconnect_module_component_terminal in an assembly
Figure 4 — Pca
Figure 5 — Layered_assembly_module_usage_view
Figure C.1 — ARM schema level EXPRESS-G diagram 1 of 1
Figure C.2 — ARM entity level EXPRESS-G diagram 1 of 2
Figure C.3 — ARM entity level EXPRESS-G diagram 2 of 2
Figure D.1 — MIM schema level EXPRESS-G diagram 1 of 1
Figure D.2 — MIM entity level EXPRESS-G diagram 1 of 1

Tables

Table A.1 — MIM short names of entities
Table E.1 — ARM and MIM EXPRESS listings

Contents

Figures

Tables