Application module: Assembly module with interconnect component ISO/TS 10303-1643:2018-11(E)
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Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM type definition
   4.3 ARM entity definitions
   4.4 ARM subtype constraint definitions
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM entity definitions
     5.2.2 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

Mapping tableIndex of EXPRESS-G pagesFirst pagePrevious page
Figure D.2 — MIM entity level EXPRESS-G diagram 1 of 1 ../../resources/product_property_representation_schema/product_property_representation_schema.htm#product_property_representation_schema.item_identified_representation_usage ../assembly_component/sys/5_mim.htm#assembly_component_mim.physical_component ../physical_component_feature/sys/5_mim.htm#physical_component_feature_mim.physical_component_feature ../../resources/product_property_representation_schema/product_property_representation_schema.htm#product_property_representation_schema.item_identified_representation_usage ../assembly_component/sys/5_mim.htm#assembly_component_mim.physical_component ../assembly_module_usage_view/sys/5_mim.htm#assembly_module_usage_view_mim.assembly_module_usage_view ../assembly_component/sys/5_mim.htm#assembly_component_mim.physical_component ../assembly_component/sys/5_mim.htm#assembly_component_mim.physical_component ../assembly_module_design/sys/5_mim.htm#assembly_module_design_mim.assembly_module_design_view ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.bare_die_component ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.routed_interconnect_component ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.layered_assembly_module_usage_view ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.layered_assembly_module_design_view ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.layered_assembly_panel_design_view ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.routed_physical_component ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.interconnect_module_component ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.interconnect_module_component_surface_feature ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.amwic_physical_component_subtypes ../assembly_module_with_interconnect_component/sys/5_mim.htm#assembly_module_with_interconnect_component_mim.amwic_assembly_module_design_view_subtypes


Figure D.2 — MIM entity level EXPRESS-G diagram 1 of 1


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