Application module: Layered interconnect module design ISO/TS 10303-1698:2018-11(E)
© ISO

Cover page
Table of contents
Copyright
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
    3.1 Terms and definitions
    3.2 Abbreviated terms

4 Information requirements
   4.1 Required AM ARMs
   4.2 ARM constant definitions
   4.3 ARM type definitions
   4.4 ARM entity definitions
   4.5 ARM subtype constraint definitions
   4.6 ARM function definitions
   4.7 ARM rule definition
5 Module interpreted model
   5.1 Mapping specification
   5.2 MIM EXPRESS short listing
     5.2.1 MIM type definitions
     5.2.2 MIM entity definitions
     5.2.3 MIM subtype constraint definitions

A MIM short names
B Information object registration
C ARM EXPRESS-G   EXPRESS-G
D MIM EXPRESS-G   EXPRESS-G
E Computer interpretable listings
F Change history
Bibliography
Index

3 Terms, definitions and abbreviated terms

3.1 Terms and definitions

3.1.1 Terms defined in ISO 10303-1

For the purposes of this document, the following terms defined in ISO 10303-1 apply:

3.1.2 Terms defined in IEC 60050-541

For the purposes of this document, the following terms defined in IEC 60050-541 apply:

3.1.3 Other terms and definitions

For the purposes of this document, the following terms and definitions apply:

3.1.3.1
breakout

conductive pattern whose purpose is to provide a transition from a tightly arranged conductive pattern that mates with a component to the circuit routing areas on a PCB

3.1.3.2
cutout

void or passage in a PCB that penetrates the entire PCB from top to bottom and whose projected shape is usually non-circular

3.1.3.3
double-sided printed circuit board

PCB with a conductive pattern on both of its sides

3.1.3.4
flexible printed circuit board

PCB that utilizes flexible insulating substrate materials with or without flexible insulating cover layers

3.1.3.5
keepout

area on a PCB or internal to a PCB inside of which components or patterns might be prohibited from being placed

3.1.3.6
multi-layer printed circuit board

PCB that consists of rigid or flexible insulation materials and with three or more alternate printed wiring or printed circuit layers that have been bonded together and electrically interconnected

3.1.3.7
rigid printed circuit board

PCB that utilizes only rigid insulating substrate materials

3.1.3.8
rigid-flex printed circuit board

PCB that utilizes both rigid and flexible insulating substrate materials

3.1.3.9
single-sided printed circuit board

PCB with a conductive pattern on only one side

3.2 Abbreviated terms

For the purposes of this document, the following abbreviated terms apply:

AM application module
AP application protocol
ARM application reference model
MIM module interpreted model
PCB Printed Circuit Board
URL uniform resource locator


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