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Application module:
Layered interconnect module design |
ISO/TS 10303-1698:2018-11(E)
© ISO
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3.1.1 Terms defined in ISO 10303-1
For the purposes of this document,
the following terms defined in
ISO 10303-1
apply:
3.1.2 Terms defined in IEC 60050-541
For the purposes of this document,
the following terms defined in
IEC 60050-541
apply:
3.1.3 Other terms and definitions
For the purposes of this document,
the following terms and definitions apply:
conductive pattern whose purpose is to provide a transition from a tightly arranged conductive pattern that mates
with a component to the circuit routing areas on a PCB
void or passage in a PCB that penetrates the entire PCB from top to bottom and whose projected shape is usually non-circular
PCB with a conductive pattern on both of its sides
PCB that utilizes flexible insulating substrate materials with or without
flexible insulating cover layers
area on a PCB or internal to a PCB inside of which components or patterns might be prohibited from being placed
PCB that consists of rigid or flexible insulation materials and with three or more alternate printed wiring or printed
circuit layers that have been bonded together and electrically interconnected
PCB that utilizes only rigid insulating substrate materials
PCB that utilizes both rigid and flexible insulating substrate materials
PCB with a conductive pattern on only one side
For the purposes of this document, the following abbreviated terms
apply:
AM |
application module |
AP |
application protocol |
ARM |
application reference model |
MIM |
module interpreted model |
PCB |
Printed Circuit Board |
URL |
uniform resource locator |
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